Flexible connection components for substrates
Custom flexible connection components that can be attached to substrates in various forms.
This is a component called FiP (Flexible Interconnect Parts) that enables flexible connections between substrates by using magnet wire in the conductor section. It enhances the freedom of connection configurations between substrates. 【Features】 - Allows for various arrangements of substrates after soldering - Slim design - Custom specifications available for length, number of poles, pitch, etc.
- Company：アイクレックス
- Price：Other
